Enhanced heat dissipation module, cooling fin structure and stamping method thereof
US10921066B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jul 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an enhanced heat dissipation module, a cooling fin structure and a stamping method thereof. The enhanced heat dissipation module includes a first cooling fin and a second cooling fin. The first cooling fin includes a first tapered tunnel protruding outwards, and the second cooling fin includes a second tapered tunnel protruding outwards. The first tapered tunnel and the second tapered tunnel jointly encircle and form a flow guide channel. Accordingly, a pressure difference is generated by hot air passing through the tapered tunnels, thereby increasing natural thermal convection and further enhancing heat dissipation efficiency of the cooling fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.