Optical module structure and fabrication method for optical module structure
US10921534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.