Electro-optical package and method of fabrication

US10921538B2 · kind B2 · utility

Assignee

• Rockley Photonics Limited · GB

Inventors

• Vivek Raghunathan · Mountain View, US
• Vivek Raghuraman · Santa Clara, US
• Karlheinz Muth · Hannover, DE
• David Arlo Nelson · Fort Collins, US
• Chia-Te Chou · New Taipei, TW
• Brett Michael Dunn Sawyer · Pasadena, US
• Seungjae Lee · Paju-si, KR

Key dates

• Filing date: Apr 11, 2019
• Grant date: Feb 16, 2021
• Expiry date: Apr 11, 2039

Classification

• Technology area (CPC —): General

Abstract

An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.