Radiation-sensitive resin composition, cured film, pattern forming method, solid-state imaging device, and image display device
US10921708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Dec 31, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.