Chip package structure, chip package method and terminal device
US10922518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Feb 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.