Wafer manufacturing system, device and method
US10922807B2 · kind B2 · utility
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2References
31Claims
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Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Dec 29, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A device includes image generation circuitry and a convolutional neural network. The image generation circuitry, in operation, generates a binned representation of a wafer defect map (WDM). The convolutional-neural-network, in operation, generates and outputs an indication of a root cause of a defect associated with the WDM based on the binned representation of the WDM and a data-driven model associating WDMs with classes of a defined set of classes of wafer defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.