Method for projecting a beam of particles onto a substrate with correction of scattering effects
US10923319B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31777
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for projecting a particle beam onto a substrate, the method includes a step of calculating a correction of the scattering effects of the beam by means of a point spread function modelling the forward scattering effects of the particles; a step of modifying a dose profile of the beam, implementing the correction thus calculated; and a step of projecting the beam, the dose profile of which has been modified, onto the substrate, and being wherein the point spread function is, or comprises by way of expression of a linear combination, a two-dimensional double sigmoid function. A method to e-beam lithography is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.