Micro-component batch transfer systems, methods, and devices
US10923378B2 · kind B2 · utility
0Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | May 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.