Optoelectronic component and method of producing same
US10923640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2016 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.