Heat exhaust and dustproof system of multi-stage distributing board
US10923890B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Oct 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02B1/28
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat exhaust and dustproof system of a multi-stage distributing board according to an embodiment of the present disclosure includes: multiple compartments provided at a cabinet of a distributing board; and multiple flaps provided at each of the multiple compartments, wherein the flaps are provided with multiple outlets for heat emission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.