Anti-pad for a printed circuit board
US10925150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1059
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.