Printed circuit board
US10925162B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09609
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided. The printed circuit board includes N power layers and a first via group. The N power layers are arranged in parallel and spaced from each other. The first via group includes M rows of vias which are disposed through the N power layers, where N and M are positive integers greater than 0. Each row of the M rows of vias is electrically connected to the first layer of the N power layers. A Pth row of the M rows of vias is further electrically connected to Q power layers of the N power layers respectively, where Q is a smallest positive integer greater than or equal to P((N−1)/M), and P is a positive integer less than or equal to M.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.