3D extended cooling mechanism for integrated server
US10925183B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Aug 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.