Nickel plated zinc alloys for coinage
US10926312B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
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Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Apr 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lower melting point metal substrate such as zinc is covered with a higher melting point metal layer such as nickel. In order to render the nickel layer suitable for coining without cracking, it is quickly annealed with a burst of induction heat. The induction heat is limited so that only the metal layer is heated without allowing substantial heat transfer to the metal substrate. This protects the metal substrate from any substantial melting, deformation or warping and maintains the metal substrate substantially intact and without a change in properties and shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.