Multi-material scanning for additive fabrication
US10926473B1 · kind B1 · utility
6Cited by
5References
16Claims
0Family size
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Key dates
| Filing date | Feb 20, 2020 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Feb 20, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A scanning approach used in the feedback procedure is able to distinguish between different materials, for example, based on spectral properties (e.g., color) of reflectance from a partially fabricated object. Because material layers can be quite thin, and in general the materials are not completely opaque, properties of subsurface layers can greatly affect the reflectance of a thin layer of one material over a thicker section of another material. Detection of locations of thin layers after a material change takes into account the reflectance characteristics of the object before the thin layer was deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.