Heat-sensitive treatment-free planographic printing plate material containing thermosensitive protection layer and application thereof

US10926566B2 · kind B2 · utility

Assignee

• Technical institute of physics and chemistry of the chinese academy of sciences · CN

Inventors

• Shuyun Zhou · Beijing, CN
• Yingquan Zou · Beijing, CN
• Jinying Liu · Beijing, CN
• Fang Xing · Beijing, CN
• Shizhuo Xiao · Beijing, CN
• Ping Chen · Dananyu, CN
• Jian Zhao · Tianjin, CN

Key dates

• Filing date: Oct 26, 2017
• Grant date: Feb 23, 2021
• Expiry date: May 3, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B41N2207/14
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

Disclosed is a heat-sensitive processless planographic printing plate material containing a thermosensitive protection layer. The planographic printing plate material sequentially comprises a supporting body, a hydrophilic layer, a heat-sensitive layer and a thermosensitive protection layer from the bottom up. The thermosensitive protection layer therein can not only isolate oxygen and protect the heat-sensitive layer from oxygen inhibition, but can also sense heat and allow a polymerization reaction to take place. Thus the binding force between same and the next layer is improved, so that the precision of printing plate images is high, the development performance is good, and the pressrun is high.