Compound for a curable composition
US10927073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Nov 5, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J175/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a curable composition which can increase cohesiveness of the cured product without increasing viscosity of the composition before curing, also minimize the increase of the elastic modulus, and also minimize the ratio of a nonreactive oligomer with an effect of improving the interfacial adhesion. The curable composition can be applied to a variety of optical applications and can be usefully used, for example, for bonding various optical functional members in a display device, for example, for directly bonding a touch panel and a display panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.