Polyamide moulding compounds with low relative permittivity
US10927254B2 · kind B2 · utility
3Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Dec 2, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.