Package structure and LED illumination module
US10928047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Mar 27, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A package for a power supply circuit and an LED illumination module are provided. The package includes: a first package body, configured to package a power device, a control chip and a passive element; an inductive element; a connector configured to connect an electrode of the inductive element to a corresponding electrode of the power device; an encapsulant configured to encapsulate the first package body, the inductive element and the connector; and multiple pins exposed through the encapsulant and configured to achieve external electrical connection. In the package, the control chip, the inductive element and the passive element are packaged together, thereby reducing an area occupied by the drive circuit in the LED illumination module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.