Assembly and process for heat transfer with three surfaces
US10928139B1 · kind B1 · utility
0Cited by
10References
20Claims
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Assignee
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Key dates
| Filing date | Jun 13, 2014 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Mar 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.