Integrated mounting solution for solid-state spin sensors used for bulk detection and imaging
US10928320B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 14, 2018 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Jan 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/1284
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Solid-state spin sensor systems and methods of manufacturing are disclosed. A mounting structure may be provided in thermal contact with a solid-state spin sensor having a plurality of color center defects such that thermal energy flows from the solid-state spin sensor to the mounting structure. A microwave application structure may be disposed on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.