Universal low profile to full height form factor adapter
US10928866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2019 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Jun 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method comprising may include mechanically coupling a first main body to a second main body mechanically via a first mechanical feature such that distance between the first main body and the second main body is variable in a first direction, mechanically coupling a chassis engagement feature to the first main body via a second mechanical feature such that distance between the chassis engagement feature and the first main body is variable in a second direction perpendicular to the first direction, wherein the chassis engagement feature is configured to mechanically engage with a chassis when the information handling resource is engaged within the chassis, and mechanically coupling a card engagement feature to the first main body via a third mechanical feature such that distance between the card engagement feature and the first main body is variable in a third direction perpendicular to the first direction and the second direction, wherein the card management feature is configured to mechanically engage with the information handling resource at an edge of the information handling resource opposite of an edge connector of the information handling resource, such that when the informa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.