Touch module, method for manufacturing the same, and electronic device using the same
US10928938B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Aug 9, 2019 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Aug 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch module comprises a substrate, the substrate includes a central region and a peripheral region, the peripheral region is surrounding the central region. A first material layer is formed on a surface of the substrate by vapor deposition. The first material layer is etched to obtain a circuit layer. The circuit layer is located in the peripheral region. A composite material layer is laid down, the composite material layer comprises a second material layer. The second material layer is positioned in the central region. The composite material layer is etched by the photo-etching. The second material layer is etched to obtain a transparent conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.