Expansion device housing multiple components
US10929327B1 · kind B1 · utility
39Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2016 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | May 9, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4282
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An expansion device is disclosed for including a plurality of modular devices within a pre-defined volume, such as the drive bay of a computing device. The expansion device may include a standardized bus connection and circuitry connecting to a controller chip, circuitry electrically coupling the controller chip to a plurality of modular devices, and a housing that houses the controller chip, connecting circuitry, and modular devices and that fits within the pre-defined volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.