Patent · US Active

Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer

US10929636B2 · kind B2 · utility

3Cited by

3References

12Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Yipeng Lu · Davis, US
Hrishikesh Vijaykumar Panchawagh · Rochester, US
Kostadin Dimitrov Djordjev · Los Gatos, US
Chin-Jen Tseng · Fremont, US
Nicholas Ian Buchan · San Jose, US
Tsongming Kao · Sunnyvale, US
Jae Hyeong Seo · Pleasanton, US

Key dates

Filing date	Jan 18, 2019
Grant date	Feb 23, 2021
Priority date	—
Expiry date	Jan 18, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG06V40/1306
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.