Patent · US Active

Device for cooling electrical components

US10930577B2 · kind B2 · utility

0Cited by

3References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Peter Taufer · Renningen, DE
Stefan Butzmann · Bünde, DE
Bernd Eckert · Lambach, DE

Key dates

Filing date	Jun 21, 2016
Grant date	Feb 23, 2021
Priority date	—
Expiry date	Jun 28, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for cooling a plurality of electrical components, each having a component cooling surface to be cooled, includes a first heat sink, a second heat sink, and a plurality of fasteners. The first heat sink has a first heat-sink cooling surface, and the second heat sink has a second heat-sink cooling surface. The first and second heat-sink cooling surfaces are positioned in a planar arrangement such that the first and second heat-sink cooling surfaces face each other. The first heat-sink cooling surface is configured to receive a first sub-set of the component cooling surfaces of the plurality of electrical components, and the second heat-sink cooling surface is configured to receive a second sub-set of the component cooling surfaces. The fasteners are configured to fasten the first and second heat-sink cooling surfaces to the corresponding component cooling surfaces of the plurality of electrical components to be applied.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.