Patent · US Active

Alternative designs for addressing contacts that enhance bend ability of TFT backplanes

US10930677B2 · kind B2 · utility

1Cited by

1References

16Claims

0Family size

Assignee

Palo Alto Research Center Incorporated · US

Inventors

Julie A. Bert · East Palo Alto, US
Robert A. Street · Palo Alto, US
John C. Knights · Soquel, US

Key dates

Filing date	Apr 12, 2018
Grant date	Feb 23, 2021
Priority date	—
Expiry date	Jun 7, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/1895
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various designs are provided to mitigate or solve limitation on the bendability of an active matrix backplanes: including breaking large rigid silicon chips (ICs) into smaller rigid ICs, changing the orientation of rigid ICs, changing the placement of the ICs on the array, thinning the ICs to the point where the Si is flexible, and replacing the ICs with high quality TFT processing which can be done on flexible substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.