Laser package with high precision lens
US10931080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2018 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02345
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure relates to optical systems and methods for their manufacture. An example method includes coupling a first surface of a light-emitter substrate to a reference surface of a carrier substrate. The method also includes registering a mold structure with respect to the reference surface of the carrier substrate. Furthermore, the method includes using the mold structure to form an optical material over at least a portion of the light-emitter substrate. The optical material is shaped according to a shape of the mold structure and includes at least one registration feature. The method also includes coupling an optical lens element to the optical material such that the optical lens element is registered to the at least one registration feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.