Substrate-embedded electronic component
US10932368B1 · kind B1 · utility
1Cited by
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 26, 2020 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Feb 26, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate-embedded electronic component includes a first core layer, a first through-portion penetrating the first core layer, a first electronic component disposed in the first through-portion, an encapsulant disposed in at least a portion of the first through-portion, and covering at least a portion of the first electronic component, a second core layer disposed on the encapsulant, and a first through-via penetrating the second core layer, wherein the first through-via is connected to the first electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.