Patent · US Active

Metal sublayer sensing in multi-layer workpiece hole drilling

US10932370B2 · kind B2 · utility

0Cited by
3References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJun 28, 2018
Grant dateFeb 23, 2021
Priority date
Expiry dateDec 31, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/0207
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Disclosed herein is a system for drilling in a multilayer printed circuit board. The system includes a source of electromagnetic radiation configured to transmit a measurement pulse in open air to a workpiece, an anode, a resettable electric charge sensor (ECS), operably connected to the anode, and a control unit, configured to receive at least one value indicative of the quantity of at least part of charged molecules received at the anode and determine a second value indicative of the quantity of charged molecules received at the anode that were derivative of emitted electrons responsive to the measurement pulse.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.