3-D flex circuit forming
US10932374B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2020 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Feb 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.