Electronic module and method for producing same
US10932386B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2018 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.