Shaping plate and method for shaping three-dimensional object by using the same
US10933619B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Jul 16, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G15/225
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A shaping plate to be set on a shaping stage of a shaping system for performing shaping by an additive manufacturing method includes a water-insoluble base substrate and an underlying layer containing a water-soluble material on at least one surface of the base substrate, wherein the base substrate has a plurality of through holes that extend in the direction intersecting the surface provided with the underlying layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.