Conductive wire disposed in a layer
US10933634B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2016 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Aug 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.