Patent · US Active

Aluminum based solderable contact

US10933675B2 · kind B2 · utility

0Cited by

16References

18Claims

0Family size

Assignees

TE Connectivity Co. Ltd. · US
TE Connectivity Germany GmbH · DE
Tyco Electronics (Shanghai) Co., Ltd. · CN

Inventors

Shallu Soneja · Fremont, US
Gokce Gulsoy · Newton, US
Yiliang Wu · Oakville, CA
Xiao (Nichee) Zhou · Shanghai, CN
Helge Schmidt · Speyer, DE
Soenke Sachs · Frankfurt am Main, DE
Felix Greiner · Stuttgart, DE

Key dates

Filing date	Nov 9, 2018
Grant date	Mar 2, 2021
Priority date	—
Expiry date	Jan 31, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/10
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.