Polysilsesquioxane resin composition for flexible substrate
US10934455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.