Light emitting diode (LED) pad mount system
US10935210B2 · kind B2 · utility
1Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2020 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Mar 27, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lighting assembly includes a heat sink including a pad surface, and an LED mounted on the pad surface. An optical device is optically coupled to the LED, and a support structure is provided for connecting the optical device to the heat sink. The support structure includes fixation spacers to connect the supporting structure to the heat sink, and both the LED and the fixation spacers contact the pad surface on a common plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.