Electronic component module
US10937710B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Oct 17, 2019 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Oct 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.