Device substrate
US10937722B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | May 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device substrate includes a first substrate, a second substrate, a plurality of first bonding pads, a plurality of second bonding pads, a plurality of first leads, and a plurality of second leads. The first and second bonding pads are separated from each other. The first bonding pads are arranged in a first column. The second bonding pads are arranged in a second column. The first and second leads respectively overlap the first and second bonding pads. The first lead includes a first extension portion and a first branch portion. The first extension portion extends from the first column to the second column. The first branch portion is connected to an end of the first extension portion close to the second column. An angle is present between the first extension portion and the first branch portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.