Method for manufacturing a sensor chip for the direct conversion of X-rays, a sensor for the direct conversion of X-rays and the dental radiology apparatus for using such a sensor
US10937921B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jun 21, 2012 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | May 9, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/444
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention relates to a method to manufacture a chip to detect the direct conversion of X-rays. It also relates to a direct conversion detector for X-rays using such a chip and dental radiology equipment using at least one such detector. The method to manufacture the wafer comprises a step for applying pressure (3, 4, 4 a) to a powdered polycrystalline semiconductor material and a step for heating (5-9) during a set time period. It comprises a preliminary step for providing an impurity level of at least 0.2% in the polycrystalline semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.