Optoelectronic component and method of producing an optoelectronic component

US10937932B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Peter Nagel · Highlands, US
• Klaus Reingruber · Langquaid, DE
• Simone Brantl · Roding, DE
• Konrad Wagner · Friedberg, DE
• Ralf Müller · Geringswalde, DE

Key dates

• Filing date: Feb 26, 2019
• Grant date: Mar 2, 2021
• Expiry date: Feb 26, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0363

Abstract

An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.