Encapsulation film
US10937990B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2017 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Apr 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/361
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.