Solidly mounted layer thin film device with grounding layer
US10938367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2017 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a substrate, a thin film piezoelectric layer, a transducer, and a low resistivity layer. The thin film piezoelectric layer is over the substrate, the transducer includes a number of electrodes in contact with the thin film piezoelectric layer and configured to transduce an acoustic wave in the thin film piezoelectric layer. The low resistivity layer is between at least a portion of the substrate and the thin film piezoelectric layer. By providing the low resistivity layer between at least a portion of the substrate and the thin film piezoelectric layer, a spurious response of the apparatus may be significantly reduced, thereby improving the performance thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.