Multiple resin over-mold for printed circuit board electronics and light guide
US10939544B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Inventors
Key dates
| Filing date | May 10, 2018 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | May 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.