Electronic component embedded substrate
US10939556B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2020 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Feb 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09827
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component embedded substrate includes first insulating layer having a first through portion; a first electronic component disposed in the first through portion; a second insulating layer disposed on the first insulating layer and having a second through portion; a second electronic component disposed in the second through portion; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component. The first through portion and the second through portion intersect, such that a portion of the first through portion and a portion of the second through portion overlap each other, on a plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.