Patent · US Active

Electronic module using board lacquer to reinforce the circuit board to the unit housing

US10939567B2 · kind B2 · utility

0Cited by

8References

13Claims

0Family size

Assignee

Bayerische Motoren Werke Aktiengesellschaft · DE

Inventors

Mike Duss · Marxzell, DE
Martin Kaltenbrunner · Taufkirchen, DE

Key dates

Filing date	Sep 17, 2019
Grant date	Mar 2, 2021
Priority date	—
Expiry date	Sep 17, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K5/06
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic module includes a carrier element and a circuit board. The circuit board is attached in and/or to the carrier element via at least one connection site. The at least one connection site is formed by means of a hardenable medium.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.