Substrate assembly and method of bonding substrates
US10940472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | May 7, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/019
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.