Method for forming dye sublimation images in and texturing of solid substrates
US10940715B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jul 9, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/0358
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for texturing a thermoplastic substrate, while forming a dye sublimation image in the thermoplastic substrate is provided. A stack comprising a thermoplastic substrate and a plurality of processing layers is provided, wherein the plurality of processing layers comprise a dye carrier having a dye image and an elastomeric membrane and wherein at least one of the processing layers of the stack is textured. A vacuum pressure is provided on the stack through an elastomeric membrane, wherein the stack is clamped together. The stack is heated to at least a sublimation temperature of the stack, wherein texture from at least one of the process layers is transferred to the thermoplastic substrate. The thermoplastic substrate is cooled to a release temperature. The vacuum pressure is removed. The thermoplastic substrate is removed from the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.