Processing a plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer
US10941069B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Feb 5, 2016 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | May 13, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer, such as for use in an electronic display screen, is processed into separate segments by first incompletely severing the workpiece along outer contours of bounded segments, by forming holes through the layer with a laser beam, leaving the segments interconnected at narrow connections, and then separating the segments by severing the web-like connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.