Composite of metal and resin
US10941323B2 · kind B2 · utility
2Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.